ASU and Deca Technologies, a premier provider of advanced wafer- and panel-level packaging technology, are collaborating to create North America’s first Fan-Out Wafer-Level Packaging (FOWLP) research and development capability.

The ASU-led SWAP Hub, a U.S. Department of Defense Microelectronics Commons Hub, advances electronic technology and workforce development for national defense.

A top Biden administration official visited ASU on Thursday to activate a new agreement in which ASU will help boost America’s semiconductor capacity overseas. Ramin Toloui, assistant secretary of the Bureau of Economic and Business Affairs in the U.S. Department of State, toured ASU’s MacroTechnology Works and met with university leadership and local semiconductor industry leaders during his daylong visit.

ASU has hired Jason Conrad as chief operations officer to help ramp up work on the Southwest Advanced Prototyping Hub’s goal — to reduce the time it takes to transform lab ideas into practical solutions in the microelectronics industry.

The U.S. Department of State awarded a $13.8 million cooperative agreement to ASU under the ITSI Fund to bolster the assembly, testing and packaging capabilities in ITSI partner countries.

ASU President Michael Crow and other members of a national advisory council on innovation and entrepreneurship recently presented a 10-action plan to the White House on U.S. leadership in advanced technology.